SP semiconductor Co., Ltd.
Global Power Semiconductor Enterprise
a step of pick-up each chip of the swan wafer by collet and stick to the lead frame with adhesive
A defect detection process for Chip solder void test and Solder Over Flow by X-Ray
a process of connecting a lead frame and a chip to allow electricity to be passed through by using a wire (Al, Au)
The semi-product in which W/B is completed is vulnerable to external environments such as heat, moisture, physical impact, etc., in order to protect chips and wires with thermosetting resin (EMC) to compensate for the weakness of the semi-products in the process
a process of cutting an unnecessary part of L/F and separating into individual states
a process of selecting good and bad products after electrical characteristic test in a PKG state