SP semiconductor Co., Ltd.
Global Power Semiconductor Enterprise
Process
Process of fixing Chip with Expand Tape and Ring Frame (Wafer Ring)
cutting the wafer by rotating the diamond blade at high speed and separating the wafer into each chip
a step of pick-up each chip of the swan wafer by collet and stick to the lead frame with adhesive
a process of connecting a lead frame and a chip to allow electricity to be passed through by using a wire (Al, Au)
The semi-product in which W/B is completed is vulnerable to external environments such as heat, moisture, physical impact, etc., in order to protect chips and wires with thermosetting resin (EMC) to compensate for the weakness of the semi-products in the process
Preventing oxidation of the lead and improving soldering property, the step of plating on the lead frame by electroplating method.
a process of cutting an unnecessary part of L/F and separating into individual states
a process of selecting good and bad products after electrical characteristic test in a PKG state